PI Film Coated Copper Wire

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The most prominent feature of PI film coated copper wire is its industry-leading extreme temperature adaptability. It can operate stably for a long time in a wide temperature range from -269°C to 400°C, and can withstand 380°C high temperature for 8 hours without cracking or melting. Its insulation layer has ultra-high mechanical strength: the tensile strength of the polyimide film itself exceeds 170 MPa, giving the wire excellent wear resistance, tear resistance and bending resistance, and the insulation will not crack even after repeated sharp bends.

In terms of electrical properties, the PI insulation layer has a low dielectric constant below 3.5, a dielectric strength of 100~300 kV/mm, and a volume resistivity as high as 10¹⁵~10¹⁷ Ω·cm, which can maintain stable insulation performance under high voltage and high frequency pulse impact. It also has excellent radiation resistance: after being subjected to 5×10⁹ rad of high-energy radiation, the strength of the insulating material still remains above 86%, and the electrical properties do not degrade significantly. In addition, the polyimide material has excellent chemical stability, does not dissolve in most organic solvents, and can withstand long-term corrosion of oil, strong acid and alkali, and humid high-heat environment.

For the new generation of extruded PI film coated flat copper wire, the minimum insulation thickness can be controlled below 0.08 mm, which is far thinner than the 0.20 mm limit of traditional wrapped PI wire. Under the same overall outer diameter, the conductor occupancy rate is increased by 30%~40%, which significantly improves the power density of the winding, reduces the volume and weight of the equipment, and effectively solves the long-standing industry pain points of traditional wrapped PI wire such as weak interlayer bonding, easy delamination and low production efficiency.